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Shenzhen Hongwei High Frequency Technology Co., Ltd.

We design and build Blister Thermoforming, Sealing and Packing Equipment as per client's requirement based on the conditions of product to Optimize Production for Lower Cost and Higher Productivity

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Semi Automatic High Frequency Sealing Machine For TPU Fabrics Bonding

Shenzhen Hongwei High Frequency Technology Co., Ltd.
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    Buy cheap Semi Automatic High Frequency Sealing Machine For TPU Fabrics Bonding from wholesalers
     
    Buy cheap Semi Automatic High Frequency Sealing Machine For TPU Fabrics Bonding from wholesalers
    • Buy cheap Semi Automatic High Frequency Sealing Machine For TPU Fabrics Bonding from wholesalers

    Semi Automatic High Frequency Sealing Machine For TPU Fabrics Bonding

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    Brand Name : Hongwei
    Model Number : HW-BP15K2R
    Price : USD 45,000
    Payment Terms : L/C, T/T
    Supply Ability : 5 Sets/Quarter
    Delivery Time : 35 Business Days
    • Product Details
    • Company Profile

    Semi Automatic High Frequency Sealing Machine For TPU Fabrics Bonding

    H-Frame High Frequency Dielectric Welding Machine with Shuttle Slides for TPU- Fabrics Bonding - Semi automatic


    Materials:TPU, PVC, PET, Fabrics

    Products:

    Toothbrush, Battery, Stationery, Food, Medical Instruments, Toys, Small hardware, Electronics parts and finished products, Automotive parts, Household applications, Cosmetics, healthcare and medical products, and other cardboard and plastic blister package, Such as Injector, Solid plastic, Model Vehicle, Clipper, Flashlight, Battery, Spark Ignition Plug, Lipstick, Coat Hook, Cleaning Balls, Razors, Correction Fluid, Pencil and the like.



    • Hongwei Special automatic tracking device with power change keeps same standard for each product, this help Save 15-20% power consumption compared with similar machine made by other manufacturer.
    • High Q-value oscillation loop design, Low power consumption stable and reliable output
    • Imported Cube HF oscillator system, Powerful output
    • Imported "5557" or "2D21" High sensitive Anti-spark device protects mould
    • High efficiency Push-plate design
    • Pneumatically-driven
    • Two Welding Heads
    • Cylinder Propping location device ensures precise plate position


    ModelHW-BP12K2RHW-BP15K2R
    Power Consumption12KW15 KW
    Power Supply380 V380 V
    Input Power12 KVA12 KVA
    RectifierSilicon DiodeSilicon Diode
    Oscillator Tube7T85RB7T69RB
    Max. Pressure600 Kg650 Kg
    Max. Gap between Electrodes300 mm350 mm
    Welding Head Travel175 mm175 mm
    Plate Size120 X 90 mm120 X 100 mm
    Time Adjustment0~10 S ( Adjustable)0~10 S ( Adjustable)
    Dimensions1000 X 2750 X 1730 mm1000 X 2750 X 1730 mm
    Net Weight350 Kg400 Kg
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